Assessment of minority-alloy component segregation (e.g. Mn, Al) in back end of line copper trench structures using Kelvin probe technique
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: 2014DOI: 10.1109/ICITCS.2014.7021784
Keyword(s): Augmented reality,IEC standards,ISO standards,Sensors,Transform coding
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Assessment of minority-alloy component segregation (e.g. Mn, Al) in back end of line copper trench structures using Kelvin probe technique
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| date accessioned | 2020-03-12T20:01:50Z | |
| date available | 2020-03-12T20:01:50Z | |
| date issued | 2014 | |
| identifier other | 6847017.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/999175 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Assessment of minority-alloy component segregation (e.g. Mn, Al) in back end of line copper trench structures using Kelvin probe technique | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8119478 | |
| subject keywords | Augmented reality | |
| subject keywords | IEC standards | |
| subject keywords | ISO standards | |
| subject keywords | Sensors | |
| subject keywords | Transform coding | |
| identifier doi | 10.1109/ICITCS.2014.7021784 | |
| journal title | dvanced Semiconductor Manufacturing Conference (ASMC), 2014 25th Annual SEMI | |
| filesize | 330540 | |
| citations | 0 | |
| contributor rawauthor | Nag, J. , Kohli, K. , Simon, A. , Krishnan, S. , Parks, C. , Ray, S. , Tijiwa-Birk, F. |