Cavity formation in bonded silicon wafers using partially cured dry etch bisbenzocyclobutene (BCB)
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: 2014DOI: 10.1109/ISSOC.2014.6972434
Keyword(s): Message systems,Topology
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Cavity formation in bonded silicon wafers using partially cured dry etch bisbenzocyclobutene (BCB)
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| contributor author | Bakhtazad, A. , Manwar, R. , Chowdhury, S. | |
| date accessioned | 2020-03-12T19:47:18Z | |
| date available | 2020-03-12T19:47:18Z | |
| date issued | 2014 | |
| identifier other | 6820298.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/990124?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Cavity formation in bonded silicon wafers using partially cured dry etch bisbenzocyclobutene (BCB) | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8106532 | |
| subject keywords | Message systems | |
| subject keywords | Topology | |
| identifier doi | 10.1109/ISSOC.2014.6972434 | |
| journal title | ircuits and Systems (LASCAS), 2014 IEEE 5th Latin American Symposium on | |
| filesize | 1368067 | |
| citations | 0 |