A Low Power CMOS Imager Based on Distributed Compressed Sensing
Year
: 2014DOI: 10.1109/PVSC.2014.6924939
Keyword(s): adhesion,copper compounds,gallium compounds,indium compounds,molybdenum,solar cells,stress analysis,thermal stability,tin compounds,zinc compounds,CIGS,Cu<,sub>,2<,/sub>,ZnSnS<,sub>,4<,/sub>,Mo,adhesion properties,bilayer back contacts,electrical properties,heat treatment,low tensile stress bilayer,morphological properties,photovoltaic applications,solar cell,stress variation,temperature 20 degC to 500 degC,thermal stability studies,Adhesives,Films,Heat
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A Low Power CMOS Imager Based on Distributed Compressed Sensing
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| contributor author | Kaliannan, B. , Pasupureddi, V.S.R. | |
| date accessioned | 2020-03-12T19:30:18Z | |
| date available | 2020-03-12T19:30:18Z | |
| date issued | 2014 | |
| identifier other | 6733188.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/979933 | |
| format | general | |
| language | English | |
| title | A Low Power CMOS Imager Based on Distributed Compressed Sensing | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8094121 | |
| subject keywords | adhesion | |
| subject keywords | copper compounds | |
| subject keywords | gallium compounds | |
| subject keywords | indium compounds | |
| subject keywords | molybdenum | |
| subject keywords | solar cells | |
| subject keywords | stress analysis | |
| subject keywords | thermal stability | |
| subject keywords | tin compounds | |
| subject keywords | zinc compounds | |
| subject keywords | CIGS | |
| subject keywords | Cu< | |
| subject keywords | sub> | |
| subject keywords | 2< | |
| subject keywords | /sub> | |
| subject keywords | ZnSnS< | |
| subject keywords | sub> | |
| subject keywords | 4< | |
| subject keywords | /sub> | |
| subject keywords | Mo | |
| subject keywords | adhesion properties | |
| subject keywords | bilayer back contacts | |
| subject keywords | electrical properties | |
| subject keywords | heat treatment | |
| subject keywords | low tensile stress bilayer | |
| subject keywords | morphological properties | |
| subject keywords | photovoltaic applications | |
| subject keywords | solar cell | |
| subject keywords | stress variation | |
| subject keywords | temperature 20 degC to 500 degC | |
| subject keywords | thermal stability studies | |
| subject keywords | Adhesives | |
| subject keywords | Films | |
| subject keywords | Heat | |
| identifier doi | 10.1109/PVSC.2014.6924939 | |
| journal title | LSI Design and 2014 13th International Conference on Embedded Systems, 2014 27th International Confe | |
| filesize | 764513 | |
| citations | 0 |