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Study and Improvement on Tungsten Plug Corrosion in CMP Process for PCRAM

contributor authorYing Li
contributor authorZhitang Song
contributor authorBo Liu
contributor authorGuanping Wu
contributor authorSonglin Feng
date accessioned2020-03-12T18:36:57Z
date available2020-03-12T18:36:57Z
date issued2014
identifier issn0894-6507
identifier other6689345.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/964447?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleStudy and Improvement on Tungsten Plug Corrosion in CMP Process for PCRAM
typeJournal Paper
contenttypeMetadata Only
identifier padid7997949
subject keywordschemical mechanical polishing
subject keywordselectrochemical electrodes
subject keywordsfailure analysis
subject keywordsphase change memories
subject keywordsplanarisation
subject keywordsslurries
subject keywordstungsten
subject keywordsBEC
subject keywordsCMP process
subject keywordsPCRAM
subject keywordsW
subject keywordsacidic buff slurry effect
subject keywordsalkali buff slurry effect
subject keywordsbottom electrode contact
subject keywordschemical mechanical planarization
subject keywordsfailure mode
subject keywordsphase change random access memory
subject keywordssize formation
subject keywordstungsten plug corrosion
subject keywordstungsten polishing step process
subject keywordsCorrosion
subject keywordsFilms
subject keywordsPhase change random access memory
subject keywordsPlugs
subject keywordsResistance
subject keywordsSlurries
subject keywordsTungsten
subject keywordsChemica
identifier doi10.1109/TSM.2013.2295163
journal titleSemiconductor Manufacturing, IEEE Transactions on
journal volume27
journal issue1
filesize7620795
citations0


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