Study and Improvement on Tungsten Plug Corrosion in CMP Process for PCRAM
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: 2014DOI: 10.1109/TSM.2013.2295163
Keyword(s): chemical mechanical polishing,electrochemical electrodes,failure analysis,phase change memories,planarisation,slurries,tungsten,BEC,CMP process,PCRAM,W,acidic buff slurry effect,alkali buff slurry effect,bottom electrode contact,chemical mechanical planarization,failure mode,phase change random access memory,size formation,tungsten plug corrosion,tungsten polishing step process,Corrosion,Films,Phase change random access memory,Plugs,Resistance,Slurries,Tungsten,Chemica
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Study and Improvement on Tungsten Plug Corrosion in CMP Process for PCRAM
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| contributor author | Ying Li | |
| contributor author | Zhitang Song | |
| contributor author | Bo Liu | |
| contributor author | Guanping Wu | |
| contributor author | Songlin Feng | |
| date accessioned | 2020-03-12T18:36:57Z | |
| date available | 2020-03-12T18:36:57Z | |
| date issued | 2014 | |
| identifier issn | 0894-6507 | |
| identifier other | 6689345.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/964447?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Study and Improvement on Tungsten Plug Corrosion in CMP Process for PCRAM | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 7997949 | |
| subject keywords | chemical mechanical polishing | |
| subject keywords | electrochemical electrodes | |
| subject keywords | failure analysis | |
| subject keywords | phase change memories | |
| subject keywords | planarisation | |
| subject keywords | slurries | |
| subject keywords | tungsten | |
| subject keywords | BEC | |
| subject keywords | CMP process | |
| subject keywords | PCRAM | |
| subject keywords | W | |
| subject keywords | acidic buff slurry effect | |
| subject keywords | alkali buff slurry effect | |
| subject keywords | bottom electrode contact | |
| subject keywords | chemical mechanical planarization | |
| subject keywords | failure mode | |
| subject keywords | phase change random access memory | |
| subject keywords | size formation | |
| subject keywords | tungsten plug corrosion | |
| subject keywords | tungsten polishing step process | |
| subject keywords | Corrosion | |
| subject keywords | Films | |
| subject keywords | Phase change random access memory | |
| subject keywords | Plugs | |
| subject keywords | Resistance | |
| subject keywords | Slurries | |
| subject keywords | Tungsten | |
| subject keywords | Chemica | |
| identifier doi | 10.1109/TSM.2013.2295163 | |
| journal title | Semiconductor Manufacturing, IEEE Transactions on | |
| journal volume | 27 | |
| journal issue | 1 | |
| filesize | 7620795 | |
| citations | 0 |