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Analysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis

contributor authorChang, J.W.
contributor authorSung, Y.I.
contributor authorLim, H.B.
date accessioned2020-03-12T18:31:03Z
date available2020-03-12T18:31:03Z
date issued2014
identifier issn0894-6507
identifier other6648445.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/961145?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleAnalysis of Plating Solutions Used in the Microelectronic Manufacturing Process Employing Capillary Electrophoresis
typeJournal Paper
contenttypeMetadata Only
identifier padid7993892
subject keywordselectrophoresis
subject keywordselectroplating
subject keywordsintegrated circuit manufacture
subject keywordsorganic compounds
subject keywordsprocess control
subject keywordsrecycling
subject keywordssemiconductor device manufacture
subject keywordsstandards
subject keywordsAu
subject keywordsCu
subject keywordsPDC
subject keywordscapillary electrophoresis
subject keywordscopper ions
subject keywordscopper plating
subject keywordsgold plating
subject keywordsinorganic ions
subject keywordsmicroelectronic manufacturing process
subject keywordsplating solutions
subject keywordsprocess control
subject keywordsproduction cost
subject keywordsproduction efficiency
subject keywordspyridine dicarboxylic acid
subject keywordsrecycling
subject keywordsrelative standard deviations
subject keywordssemiconductor manufacturing process
subject keywordssulfate matrix
subject keywordstris bu
identifier doi10.1109/TSM.2013.2287492
journal titleSemiconductor Manufacturing, IEEE Transactions on
journal volume27
journal issue1
filesize245203
citations0


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