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contributor authorPeisheng Liu
contributor authorJinlan Wang
contributor authorLiangyu Tong
contributor authorYujuan Tao
date accessioned2020-03-12T16:20:53Z
date available2020-03-12T16:20:53Z
date issued2014
identifier otherVhv6ebQ7uLEiKf_8RT5jJyUzHxuWYltmqszCPCEmwrLXXhCESb.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/925183?locale-attribute=fa&show=full
formatgeneral
languageEnglish
titleAdvances in the Fabrication Processes and Applications of Wafer Level Packaging
typeJournal Paper
contenttypeFulltext
contenttypeFulltext
identifier padid7609253
identifier doi10.1115/1.4027397
journal titleJournal of Electronic Packaging
coverageAcademic
journal volume136
journal issue2
filesize1789943
citations1


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