Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers
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: 2012DOI: 10.1115/1.4006177
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Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers
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| contributor author | Hao Wu | |
| contributor author | Shreyes N. Melkote | |
| date accessioned | 2020-03-15T21:03:38Z | |
| date available | 2020-03-15T21:03:38Z | |
| date issued | 2012 | |
| identifier other | r6jVy8QyeYGDAU4QbD71tRBZmb1lbVloQmIGQYNHLgqtDq3bVr.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/2060824?locale-attribute=en | |
| format | general | |
| language | English | |
| title | Study of Ductile-to-Brittle Transition in Single Grit Diamond Scribing of Silicon: Application to Wire Sawing of Silicon Wafers | |
| type | Journal Paper | |
| contenttype | Fulltext | |
| contenttype | Fulltext | |
| identifier padid | 14177448 | |
| identifier doi | 10.1115/1.4006177 | |
| journal title | Journal of Engineering Materials and Technology | |
| coverage | Academic | |
| journal volume | 134 | |
| journal issue | 4 | |
| filesize | 2666383 | |
| citations | 1 |