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Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias

contributor authorCui Huang
contributor authorLiyang Pan
contributor authorRan Liu
contributor authorZheyao Wang
date accessioned2020-03-13T00:28:10Z
date available2020-03-13T00:28:10Z
date issued2014
identifier issn2156-3950
identifier other6945811.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1147902?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleThermal and Electrical Properties of BCB-Liner Through-Silicon Vias
typeJournal Paper
contenttypeMetadata Only
identifier padid8330931
subject keywordscapacitance measurement
subject keywordselectric current measurement
subject keywordselectric properties
subject keywordsintegrated circuit testing
subject keywordsleakage currents
subject keywordsorganic compounds
subject keywordsthermal expansion
subject keywordsthermal stability
subject keywordsthree-dimensional integrated circuits
subject keywordsvoltage measurement
subject keywordsBCB-liner TSV
subject keywordsBCB-liner through-silicon vias
subject keywordsC-V characteristics
subject keywordsI-V characteristics
subject keywordsTSV capacitances
subject keywordsbenzocyclobutene
subject keywordselectrical properties
subject keywordsleakage current
subject keywordsroom temperature
subject keywordstemperature -65 degC to 150 degC
subject keywordsthermal cycling
subject keywordsthermal expansion stresses
identifier doi10.1109/TCPMT.2014.2363659
journal titleComponents, Packaging and Manufacturing Technology, IEEE Transactions on
journal volume4
journal issue12
filesize2012297
citations0


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