Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias
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سال
: 2014شناسه الکترونیک: 10.1109/TCPMT.2014.2363659
کلیدواژه(گان): capacitance measurement,electric current measurement,electric properties,integrated circuit testing,leakage currents,organic compounds,thermal expansion,thermal stability,three-dimensional integrated circuits,voltage measurement,BCB-liner TSV,BCB-liner through-silicon vias,C-V characteristics,I-V characteristics,TSV capacitances,benzocyclobutene,electrical properties,leakage current,room temperature,temperature -65 degC to 150 degC,thermal cycling,thermal expansion stresses
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آمار بازدید
Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias
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| contributor author | Cui Huang | |
| contributor author | Liyang Pan | |
| contributor author | Ran Liu | |
| contributor author | Zheyao Wang | |
| date accessioned | 2020-03-13T00:28:10Z | |
| date available | 2020-03-13T00:28:10Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6945811.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1147902 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Thermal and Electrical Properties of BCB-Liner Through-Silicon Vias | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8330931 | |
| subject keywords | capacitance measurement | |
| subject keywords | electric current measurement | |
| subject keywords | electric properties | |
| subject keywords | integrated circuit testing | |
| subject keywords | leakage currents | |
| subject keywords | organic compounds | |
| subject keywords | thermal expansion | |
| subject keywords | thermal stability | |
| subject keywords | three-dimensional integrated circuits | |
| subject keywords | voltage measurement | |
| subject keywords | BCB-liner TSV | |
| subject keywords | BCB-liner through-silicon vias | |
| subject keywords | C-V characteristics | |
| subject keywords | I-V characteristics | |
| subject keywords | TSV capacitances | |
| subject keywords | benzocyclobutene | |
| subject keywords | electrical properties | |
| subject keywords | leakage current | |
| subject keywords | room temperature | |
| subject keywords | temperature -65 degC to 150 degC | |
| subject keywords | thermal cycling | |
| subject keywords | thermal expansion stresses | |
| identifier doi | 10.1109/TCPMT.2014.2363659 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 12 | |
| filesize | 2012297 | |
| citations | 0 |