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Design of Novel High-Q Multipath Parallel-Stacked Inductor

Author:
Vanukuru, Venkata Narayana Rao
,
Chakravorty, Anjan
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/TED.2014.2359497
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1146110
Keyword(s): Q-factor,inductors,silicon-on-insulator,DC-DC buck converters,current crowding effects,dual thick metal stack process,equal path lengths,high-Q multipath parallel-stacked inductor structure design,high-resistivity silicon-on-insulator technology,magnetic materials,metal layers,multipath architecture,quality factor,radio frequency circuits,size 0.18 mum,spiral thickness,via resistance,Inductors,Metals,Proximity effects,Radio frequency,Resistance,Solids,Spirals,Buck convert
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    Design of Novel High-Q Multipath Parallel-Stacked Inductor

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contributor authorVanukuru, Venkata Narayana Rao
contributor authorChakravorty, Anjan
date accessioned2020-03-13T00:25:16Z
date available2020-03-13T00:25:16Z
date issued2014
identifier issn0018-9383
identifier other6918399.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1146110?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleDesign of Novel High-Q Multipath Parallel-Stacked Inductor
typeJournal Paper
contenttypeMetadata Only
identifier padid8328899
subject keywordsQ-factor
subject keywordsinductors
subject keywordssilicon-on-insulator
subject keywordsDC-DC buck converters
subject keywordscurrent crowding effects
subject keywordsdual thick metal stack process
subject keywordsequal path lengths
subject keywordshigh-Q multipath parallel-stacked inductor structure design
subject keywordshigh-resistivity silicon-on-insulator technology
subject keywordsmagnetic materials
subject keywordsmetal layers
subject keywordsmultipath architecture
subject keywordsquality factor
subject keywordsradio frequency circuits
subject keywordssize 0.18 mum
subject keywordsspiral thickness
subject keywordsvia resistance
subject keywordsInductors
subject keywordsMetals
subject keywordsProximity effects
subject keywordsRadio frequency
subject keywordsResistance
subject keywordsSolids
subject keywordsSpirals
subject keywordsBuck convert
identifier doi10.1109/TED.2014.2359497
journal titleElectron Devices, IEEE Transactions on
journal volume61
journal issue11
filesize1693961
citations0
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