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contributor authorZheng Fang
contributor authorXin Peng Wang
contributor authorJoon Sohn
contributor authorBao Bin Weng
contributor authorZhi Ping Zhang
contributor authorZhi Xian Chen
contributor authorYan Zhe Tang
contributor authorGuo-Qiang Lo
contributor authorProvine, J.
contributor authorWong, S. Simon
contributor authorWong, H.-S Philip
contributor authorDim-Lee Kwong
date accessioned2020-03-13T00:13:54Z
date available2020-03-13T00:13:54Z
date issued2014
identifier issn0741-3106
identifier other6856165.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1139075?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleThe Role of Ti Capping Layer in HfO<sub><italic>x</italic></sub>-Based RRAM Devices
typeJournal Paper
contenttypeMetadata Only
identifier padid8321259
subject keywordshafnium compounds
subject keywordsrandom-access storage
subject keywordstitanium
subject keywordsHfO<
subject keywordssub>
subject keywordsx<
subject keywords/sub>
subject keywordsRRAM devices
subject keywordsTi
subject keywordscapping layer
subject keywordsmemory performance
subject keywordsoxygen reservoir
subject keywordsresistive random access memory device
subject keywordsresistive switching
subject keywordssize 10 nm
subject keywordssize 8 nm
subject keywordsElectrodes
subject keywordsElectron devices
subject keywordsHafnium compounds
subject keywordsPerformance evaluation
subject keywordsResistance
subject keywordsSwitches
subject keywordsNonvolatile memory
subject keywordsTi capping
subject keywordsTi capping.
subject keywordsresistive random access memory (RRAM)
subject keywordsresistive switching (RS)
identifier doi10.1109/LED.2014.2334311
journal titleElectron Device Letters, IEEE
journal volume35
journal issue9
filesize799218
citations0


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