A Novel Silicon-Based LED Packaging Module With an Integrated Temperature Sensor
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: 2014شناسه الکترونیک: 10.1109/TCPMT.2014.2305169
کلیدواژه(گان): elemental semiconductors,finite element analysis,light emitting diodes,modules,silicon,temperature sensors,thermal conductivity,thermal management (packaging),Si,bilayer sensing film,finite element analysis,integrated temperature sensor,light-emitting diode,sensitivity measurement,silicon-based LED packaging module,size 1.4 mm,thermal conductivity characteristics,thermal management,Heat sinks,Light emitting diodes,Packaging,Temperature measurement,Temperature sensors,Therm
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A Novel Silicon-Based LED Packaging Module With an Integrated Temperature Sensor
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| contributor author | Shengwei Chang | |
| contributor author | Chingfu Tsou | |
| date accessioned | 2020-03-12T23:48:24Z | |
| date available | 2020-03-12T23:48:24Z | |
| date issued | 2014 | |
| identifier issn | 2156-3950 | |
| identifier other | 6747377.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1124012?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | A Novel Silicon-Based LED Packaging Module With an Integrated Temperature Sensor | |
| type | Journal Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8303528 | |
| subject keywords | elemental semiconductors | |
| subject keywords | finite element analysis | |
| subject keywords | light emitting diodes | |
| subject keywords | modules | |
| subject keywords | silicon | |
| subject keywords | temperature sensors | |
| subject keywords | thermal conductivity | |
| subject keywords | thermal management (packaging) | |
| subject keywords | Si | |
| subject keywords | bilayer sensing film | |
| subject keywords | finite element analysis | |
| subject keywords | integrated temperature sensor | |
| subject keywords | light-emitting diode | |
| subject keywords | sensitivity measurement | |
| subject keywords | silicon-based LED packaging module | |
| subject keywords | size 1.4 mm | |
| subject keywords | thermal conductivity characteristics | |
| subject keywords | thermal management | |
| subject keywords | Heat sinks | |
| subject keywords | Light emitting diodes | |
| subject keywords | Packaging | |
| subject keywords | Temperature measurement | |
| subject keywords | Temperature sensors | |
| subject keywords | Therm | |
| identifier doi | 10.1109/TCPMT.2014.2305169 | |
| journal title | Components, Packaging and Manufacturing Technology, IEEE Transactions on | |
| journal volume | 4 | |
| journal issue | 5 | |
| filesize | 1388531 | |
| citations | 0 |