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Effects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs

contributor authorFilipovic, L. , de Orio, R.L. , Selberherr, S.
date accessioned2020-03-12T23:32:39Z
date available2020-03-12T23:32:39Z
date issued2014
identifier other6898137.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115455?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleEffects of sidewall scallops on the performance and reliability of filled copper and open tungsten TSVs
typeConference Paper
contenttypeMetadata Only
identifier padid8284904
subject keywordsAutomotive engineering
subject keywordsCapacitors
subject keywordsInductors
subject keywordsSwitches
subject keywordsSwitching loss
subject keywordsTopology
subject keywordsWindings
identifier doi10.1109/ECCE.2014.6953412
journal titlehysical and Failure Analysis of Integrated Circuits (IPFA), 2014 IEEE 21st International Symposium o
filesize5423179
citations0


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