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Early-state crack detection method for heel-cracks in wire bond interconnects

date accessioned2020-03-12T23:32:03Z
date available2020-03-12T23:32:03Z
date issued2014
identifier other6897275.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1115096?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleEarly-state crack detection method for heel-cracks in wire bond interconnects
typeConference Paper
contenttypeMetadata Only
identifier padid8284491
subject keywordscomputer aided instruction
subject keywordsinformation management
subject keywordscurricular design
subject keywordsdigital learning environment
subject keywordsinformation management
subject keywordslearning process optimization
subject keywordsliterature searching
subject keywordsComputers
subject keywordsCouplings
subject keywordsDatabases
subject keywordsEducation
subject keywordsInformation services
subject keywordsOptimization
subject keywordsReflection
subject keywordsdigital learning
subject keywordsenvironment
subject keywordsoptimization of the learning process
identifier doi10.1109/ICCSE.2014.6926480
journal titlelectronic Components and Technology Conference (ECTC), 2014 IEEE 64th
filesize2913771
citations0
contributor rawauthorKruger, M. , Trampert, S. , Middendorf, A. , Schmitz, S. , Lang, K.-D.


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