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Fatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method

Author:
Ghodke, N. , Kumbhakarna, D. , Nakanekar, S. , Tonapi, S.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ISSREW.2014.80
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1111877
Keyword(s): Cloud computing,Contracts,Law,Outsourcing,Risk management,Security,Cloud,Outsourcing,Risk Assessment,Risk Management,Security
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    Fatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method

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date accessioned2020-03-12T23:26:44Z
date available2020-03-12T23:26:44Z
date issued2014
identifier other6892335.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1111877?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleFatigue life prediction for solder interconnects in IGBT modules by using the successive initiation method
typeConference Paper
contenttypeMetadata Only
identifier padid8280744
subject keywordsCloud computing
subject keywordsContracts
subject keywordsLaw
subject keywordsOutsourcing
subject keywordsRisk management
subject keywordsSecurity
subject keywordsCloud
subject keywordsOutsourcing
subject keywordsRisk Assessment
subject keywordsRisk Management
subject keywordsSecurity
identifier doi10.1109/ISSREW.2014.80
journal titlehermal and Thermomechanical Phenomena in Electronic Systems (ITherm), 2014 IEEE Intersociety Confere
filesize567504
citations0
contributor rawauthorGhodke, N. , Kumbhakarna, D. , Nakanekar, S. , Tonapi, S.
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