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Influence of sintering process parameters on mechanical strength of joints based on silver nano particles

Author:
Falat, Tomasz
,
Stojek, Krzysztof
,
Matkowski, Przemyslaw
,
Platek, Bartosz
,
Felba, Jan
,
Moscicki, Andrzej
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ICRAIE.2014.6909311
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1098160
Keyword(s): IEEE 802.15 Standards,n Wireless sensor networks,n Base station,n data aggregation,n energy efficient,n minimum spanning tree,n sensor nodes
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    Influence of sintering process parameters on mechanical strength of joints based on silver nano particles

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contributor authorFalat, Tomasz
contributor authorStojek, Krzysztof
contributor authorMatkowski, Przemyslaw
contributor authorPlatek, Bartosz
contributor authorFelba, Jan
contributor authorMoscicki, Andrzej
date accessioned2020-03-12T22:53:30Z
date available2020-03-12T22:53:30Z
date issued2014
identifier other7028379.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1098160
formatgeneral
languageEnglish
publisherIEEE
titleInfluence of sintering process parameters on mechanical strength of joints based on silver nano particles
typeConference Paper
contenttypeMetadata Only
identifier padid8239244
subject keywordsIEEE 802.15 Standards
subject keywordsn Wireless sensor networks
subject keywordsn Base station
subject keywordsn data aggregation
subject keywordsn energy efficient
subject keywordsn minimum spanning tree
subject keywordsn sensor nodes
identifier doi10.1109/ICRAIE.2014.6909311
journal titlelectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th
filesize370120
citations0
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