Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/ICRAIE.2014.6909220
کلیدواژه(گان): Accuracy,n Blogs,n Integrated circuits,n Testing,n Training,n Sentiment analysis,n intensifier,n objective words,n opinion mining,n sentiment polarity,n subjective words
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آمار بازدید
Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates
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| contributor author | Fouzder, Tama | |
| contributor author | Chan, Y.C. | |
| contributor author | Chan, Daniel K. | |
| date accessioned | 2020-03-12T22:53:22Z | |
| date available | 2020-03-12T22:53:22Z | |
| date issued | 2014 | |
| identifier other | 7028281.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1098068?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Interfacial microstructure and shear strength of Sn-Ag-Cu based composite solders on Cu and Au/Ni metallized Cu substrates | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8239101 | |
| subject keywords | Accuracy | |
| subject keywords | n Blogs | |
| subject keywords | n Integrated circuits | |
| subject keywords | n Testing | |
| subject keywords | n Training | |
| subject keywords | n Sentiment analysis | |
| subject keywords | n intensifier | |
| subject keywords | n objective words | |
| subject keywords | n opinion mining | |
| subject keywords | n sentiment polarity | |
| subject keywords | n subjective words | |
| identifier doi | 10.1109/ICRAIE.2014.6909220 | |
| journal title | lectronics Packaging Technology Conference (EPTC), 2014 IEEE 16th | |
| filesize | 745232 | |
| citations | 0 |