Context-aware wireless broadcast for next generation cellular networks
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سال
: 2014شناسه الکترونیک: 10.1109/APS.2014.6905384
کلیدواژه(گان): chip-on-board packaging,n electromagnetic wave scattering,n integrated circuit interconnections,n integrated circuit modelling,n integrated circuit packaging,n numerical analysis,n substrate integrated waveguides,n three-dimensional integrated circuits,n 3D ICs,n Foldy-Lax multiple scattering equation method,n SIW structure,n chip-package- board system,n electromagnetic modeling,n multiple horizontal interconnection mode,n multiple vertical interconnecti
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Context-aware wireless broadcast for next generation cellular networks
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| contributor author | Huang, Linyu | |
| contributor author | Sung, Chi Wan | |
| contributor author | Chen, Chung Shue | |
| date accessioned | 2020-03-12T22:48:53Z | |
| date available | 2020-03-12T22:48:53Z | |
| date issued | 2014 | |
| identifier other | 7024823.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1095488?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Context-aware wireless broadcast for next generation cellular networks | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8235741 | |
| subject keywords | chip-on-board packaging | |
| subject keywords | n electromagnetic wave scattering | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n integrated circuit modelling | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n numerical analysis | |
| subject keywords | n substrate integrated waveguides | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 3D ICs | |
| subject keywords | n Foldy-Lax multiple scattering equation method | |
| subject keywords | n SIW structure | |
| subject keywords | n chip-package- board system | |
| subject keywords | n electromagnetic modeling | |
| subject keywords | n multiple horizontal interconnection mode | |
| subject keywords | n multiple vertical interconnecti | |
| identifier doi | 10.1109/APS.2014.6905384 | |
| journal title | ommunication Systems (ICCS), 2014 IEEE International Conference on | |
| filesize | 166878 | |
| citations | 0 |