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Design and analyses of stress - strain distribution in new coupling for lower limb prosthesis (CLLP) using finite element method

contributor authorRayothee, P.
contributor authorSasaki, K.
date accessioned2020-03-12T22:38:14Z
date available2020-03-12T22:38:14Z
date issued2014
identifier other7017425.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089529?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleDesign and analyses of stress - strain distribution in new coupling for lower limb prosthesis (CLLP) using finite element method
typeConference Paper
contenttypeMetadata Only
identifier padid8227756
subject keywordschip scale packaging
subject keywordsn metallisation
subject keywordsn solders
subject keywordsn board level assembly
subject keywordsn fatigue life
subject keywordsn laminated dielectric layers
subject keywordsn low CTE glass package to PCB interconnections
subject keywordsn metallization layers
subject keywordsn plastic strain concentration
subject keywordsn polymer collars
subject keywordsn solder package interface
subject keywordsn solder strain relief
subject keywordsn spin coating
subject keywordsn thermal cycling reliability testing
subject keywordsn Assembly
subject keywordsn Glass
subject keywordsn Polymers
subject keywordsn Reliability
subject keywordsn Strain
subject keywordsn Surface treatment
identifier doi10.1109/ECTC.2014.6897571
journal titleiomedical Engineering International Conference (BMEiCON), 2014 7th
filesize422681
citations0


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