Design and analyses of stress - strain distribution in new coupling for lower limb prosthesis (CLLP) using finite element method
Publisher:
Year
: 2014DOI: 10.1109/ECTC.2014.6897571
Keyword(s): chip scale packaging,n metallisation,n solders,n board level assembly,n fatigue life,n laminated dielectric layers,n low CTE glass package to PCB interconnections,n metallization layers,n plastic strain concentration,n polymer collars,n solder package interface,n solder strain relief,n spin coating,n thermal cycling reliability testing,n Assembly,n Glass,n Polymers,n Reliability,n Strain,n Surface treatment
Collections
:
-
Statistics
Design and analyses of stress - strain distribution in new coupling for lower limb prosthesis (CLLP) using finite element method
Show full item record
| contributor author | Rayothee, P. | |
| contributor author | Sasaki, K. | |
| date accessioned | 2020-03-12T22:38:14Z | |
| date available | 2020-03-12T22:38:14Z | |
| date issued | 2014 | |
| identifier other | 7017425.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089529?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Design and analyses of stress - strain distribution in new coupling for lower limb prosthesis (CLLP) using finite element method | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227756 | |
| subject keywords | chip scale packaging | |
| subject keywords | n metallisation | |
| subject keywords | n solders | |
| subject keywords | n board level assembly | |
| subject keywords | n fatigue life | |
| subject keywords | n laminated dielectric layers | |
| subject keywords | n low CTE glass package to PCB interconnections | |
| subject keywords | n metallization layers | |
| subject keywords | n plastic strain concentration | |
| subject keywords | n polymer collars | |
| subject keywords | n solder package interface | |
| subject keywords | n solder strain relief | |
| subject keywords | n spin coating | |
| subject keywords | n thermal cycling reliability testing | |
| subject keywords | n Assembly | |
| subject keywords | n Glass | |
| subject keywords | n Polymers | |
| subject keywords | n Reliability | |
| subject keywords | n Strain | |
| subject keywords | n Surface treatment | |
| identifier doi | 10.1109/ECTC.2014.6897571 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 422681 | |
| citations | 0 |