Design, simulation and implementation of a novel online patients' health checking method for physicians
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: 2014DOI: 10.1109/ECTC.2014.6897561
Keyword(s): copper,n elemental semiconductors,n filling,n semiconductor device reliability,n semiconductor technology,n silicon,n three-dimensional integrated circuits,n wafer level packaging,n wafer-scale integration,n Cu,n Si,n blind vias,n bottom-up TSV filling,n bumpless TSV integration approach,n carrier wafer,n copper RDL,n one-time bottom-up copper filling,n prepatterned BCB,n release layer,n resistance 7.6 mohm,n seed layer,n silicon waf
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Design, simulation and implementation of a novel online patients' health checking method for physicians
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| contributor author | Turjo, F.O. | |
| contributor author | Islam, M.A. | |
| contributor author | Bhuiyan, S.U. | |
| contributor author | Islam, T. | |
| contributor author | Pathik, B.B. | |
| date accessioned | 2020-03-12T22:38:13Z | |
| date available | 2020-03-12T22:38:13Z | |
| date issued | 2014 | |
| identifier other | 7017415.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089520 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Design, simulation and implementation of a novel online patients' health checking method for physicians | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227746 | |
| subject keywords | copper | |
| subject keywords | n elemental semiconductors | |
| subject keywords | n filling | |
| subject keywords | n semiconductor device reliability | |
| subject keywords | n semiconductor technology | |
| subject keywords | n silicon | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n wafer level packaging | |
| subject keywords | n wafer-scale integration | |
| subject keywords | n Cu | |
| subject keywords | n Si | |
| subject keywords | n blind vias | |
| subject keywords | n bottom-up TSV filling | |
| subject keywords | n bumpless TSV integration approach | |
| subject keywords | n carrier wafer | |
| subject keywords | n copper RDL | |
| subject keywords | n one-time bottom-up copper filling | |
| subject keywords | n prepatterned BCB | |
| subject keywords | n release layer | |
| subject keywords | n resistance 7.6 mohm | |
| subject keywords | n seed layer | |
| subject keywords | n silicon waf | |
| identifier doi | 10.1109/ECTC.2014.6897561 | |
| journal title | iomedical Engineering International Conference (BMEiCON), 2014 7th | |
| filesize | 1583658 | |
| citations | 0 |