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Sign language-Thai alphabet conversion based on Electromyogram (EMG)

contributor authorAmatanon, V.
contributor authorChanhang, S.
contributor authorNaiyanetr, P.
contributor authorThongpang, S.
date accessioned2020-03-12T22:38:11Z
date available2020-03-12T22:38:11Z
date issued2014
identifier other7017398.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089503?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleSign language-Thai alphabet conversion based on Electromyogram (EMG)
typeConference Paper
contenttypeMetadata Only
identifier padid8227725
subject keywordsflip-chip devices
subject keywordsn integrated circuit bonding
subject keywordsn integrated circuit packaging
subject keywordsn reflow soldering
subject keywordsn three-dimensional integrated circuits
subject keywordsn 2.5D packaging assembly
subject keywordsn 3D packaging assembly
subject keywordsn HAST behavior
subject keywordsn flip chip assembly
subject keywordsn highly silica filled one step chip attach material
subject keywordsn mass reflow processes
subject keywordsn organic fluids
subject keywordsn over collapse
subject keywordsn reflow soldering
subject keywordsn solder oxide removal
subject keywordsn solder wetting
subject keywordsn surface finishing
subject keywordsn thermal compression bonding
subject keywordsn v
identifier doi10.1109/ECTC.2014.6897543
journal titleiomedical Engineering International Conference (BMEiCON), 2014 7th
filesize1366534
citations0


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