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contributor authorCosta, Lauro Beltrao
contributor authorBrunet, Joao
contributor authorHattori, Lile
contributor authorRipeanu, Matei
date accessioned2020-03-12T22:38:04Z
date available2020-03-12T22:38:04Z
date issued2014
identifier other7017327.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089432?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleExperience with Using a Performance Predictor during Development: A Distributed Storage System Tale
typeConference Paper
contenttypeMetadata Only
identifier padid8227644
subject keywordsintegrated circuit bonding
subject keywordsn integrated circuit interconnections
subject keywordsn integrated circuit packaging
subject keywordsn optimisation
subject keywordsn BVA manufacturing process
subject keywordsn BVA technology
subject keywordsn HVM
subject keywordsn PoP configuration
subject keywordsn bond via array technology
subject keywordsn critical assembly process steps
subject keywordsn high volume manufacturing
subject keywordsn package footprint
subject keywordsn package reliability
subject keywordsn size 0.24 mm
subject keywordsn size 14 mm
subject keywordsn test vehicle design optimization
subject keywordsn ultra-high bandwidth package-on-package
subject keywordsn vertical connections
subject keywordsn Ar
identifier doi10.1109/ECTC.2014.6897474
journal titleoftware Engineering for High Performance Computing in Computational Science and Engineering (SE-HPCC
filesize169927
citations0


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