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FEOL post CMP cleaner development

contributor authorCuong Tran
contributor authorMedd, S.
contributor authorFrye, D.
date accessioned2020-03-12T22:37:57Z
date available2020-03-12T22:37:57Z
date issued2014
identifier other7017262.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1089365?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleFEOL post CMP cleaner development
typeConference Paper
contenttypeMetadata Only
identifier padid8227568
subject keywordsWeibull distribution
subject keywordsn ball grid arrays
subject keywordsn copper alloys
subject keywordsn plastic packaging
subject keywordsn reliability
subject keywordsn silver alloys
subject keywordsn solders
subject keywordsn thermal stress cracking
subject keywordsn tin alloys
subject keywordsn CABGA 144
subject keywordsn PBGA 324
subject keywordsn PBGA 676
subject keywordsn SnAgCu
subject keywordsn Weibull life distributions
subject keywordsn damage equivalency model
subject keywordsn damage pre-cursor based life prediction models
subject keywordsn intermetallic thickness
subject keywordsn mean cyclic temperature
subject keywordsn phase-growth rate
subject keywordsn second level interconnects
subject keywordsn solder joint reliability
subject keywordsn temp
identifier doi10.1109/ECTC.2014.6897409
journal titlelanarization/CMP Technology (ICPT), 2014 International Conference on
filesize2822096
citations0


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