FEOL post CMP cleaner development
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Year
: 2014DOI: 10.1109/ECTC.2014.6897409
Keyword(s): Weibull distribution,n ball grid arrays,n copper alloys,n plastic packaging,n reliability,n silver alloys,n solders,n thermal stress cracking,n tin alloys,n CABGA 144,n PBGA 324,n PBGA 676,n SnAgCu,n Weibull life distributions,n damage equivalency model,n damage pre-cursor based life prediction models,n intermetallic thickness,n mean cyclic temperature,n phase-growth rate,n second level interconnects,n solder joint reliability,n temp
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FEOL post CMP cleaner development
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| contributor author | Cuong Tran | |
| contributor author | Medd, S. | |
| contributor author | Frye, D. | |
| date accessioned | 2020-03-12T22:37:57Z | |
| date available | 2020-03-12T22:37:57Z | |
| date issued | 2014 | |
| identifier other | 7017262.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089365?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | FEOL post CMP cleaner development | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227568 | |
| subject keywords | Weibull distribution | |
| subject keywords | n ball grid arrays | |
| subject keywords | n copper alloys | |
| subject keywords | n plastic packaging | |
| subject keywords | n reliability | |
| subject keywords | n silver alloys | |
| subject keywords | n solders | |
| subject keywords | n thermal stress cracking | |
| subject keywords | n tin alloys | |
| subject keywords | n CABGA 144 | |
| subject keywords | n PBGA 324 | |
| subject keywords | n PBGA 676 | |
| subject keywords | n SnAgCu | |
| subject keywords | n Weibull life distributions | |
| subject keywords | n damage equivalency model | |
| subject keywords | n damage pre-cursor based life prediction models | |
| subject keywords | n intermetallic thickness | |
| subject keywords | n mean cyclic temperature | |
| subject keywords | n phase-growth rate | |
| subject keywords | n second level interconnects | |
| subject keywords | n solder joint reliability | |
| subject keywords | n temp | |
| identifier doi | 10.1109/ECTC.2014.6897409 | |
| journal title | lanarization/CMP Technology (ICPT), 2014 International Conference on | |
| filesize | 2822096 | |
| citations | 0 |