Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP
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Year
: 2014DOI: 10.1109/ECTC.2014.6897389
Keyword(s): microassembling,n three-dimensional integrated circuits,n 3D assembly technology,n 3D compliant chip assembly,n 3D die stacking challenges,n die-to-die assembly,n integrated assembly,n size 300 mm,n wafer-to-wafer assembly,n Assembly,n Bonding,n Flip-chip devices,n Resistance,n Semiconductor device measurement,n Three-dimensional displays,n Through-silicon vias
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Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP
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| contributor author | Yun Zhuang | |
| contributor author | Sampurno, Y. | |
| contributor author | Borucki, L. | |
| contributor author | Philipossian, A. | |
| date accessioned | 2020-03-12T22:37:54Z | |
| date available | 2020-03-12T22:37:54Z | |
| date issued | 2014 | |
| identifier other | 7017242.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089341 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Novel slurry injection system for improved slurry flow, enhanced material removal and reduced defects in CMP | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227539 | |
| subject keywords | microassembling | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 3D assembly technology | |
| subject keywords | n 3D compliant chip assembly | |
| subject keywords | n 3D die stacking challenges | |
| subject keywords | n die-to-die assembly | |
| subject keywords | n integrated assembly | |
| subject keywords | n size 300 mm | |
| subject keywords | n wafer-to-wafer assembly | |
| subject keywords | n Assembly | |
| subject keywords | n Bonding | |
| subject keywords | n Flip-chip devices | |
| subject keywords | n Resistance | |
| subject keywords | n Semiconductor device measurement | |
| subject keywords | n Three-dimensional displays | |
| subject keywords | n Through-silicon vias | |
| identifier doi | 10.1109/ECTC.2014.6897389 | |
| journal title | lanarization/CMP Technology (ICPT), 2014 International Conference on | |
| filesize | 634488 | |
| citations | 0 |