| contributor author | Zhou Bing | |
| contributor author | Zhou Yanjie | |
| contributor author | Xu Mingliang | |
| contributor author | Wu Fei | |
| date accessioned | 2020-03-12T22:37:49Z | |
| date available | 2020-03-12T22:37:49Z | |
| date issued | 2014 | |
| identifier other | 7017207.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089300?locale-attribute=en&show=full | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Computation-aware motion estimation algorithm based on QoE control | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227490 | |
| subject keywords | CMOS integrated circuits | |
| subject keywords | n copper | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n silicon | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n wafer bonding | |
| subject keywords | n 3Di wafer stacking | |
| subject keywords | n CALM | |
| subject keywords | n CMOS devices | |
| subject keywords | n Cu | |
| subject keywords | n Si | |
| subject keywords | n TSV interconnections | |
| subject keywords | n cavity alignment method | |
| subject keywords | n chip bonding process technologies | |
| subject keywords | n chip level bonding | |
| subject keywords | n oxide bonding | |
| subject keywords | n reflow furnace | |
| subject keywords | n size 10 mum | |
| subject keywords | n size 22 nm | |
| subject keywords | n size 300 mm | |
| subject keywords | n size 45 nm | |
| subject keywords | n thermo-compression | |
| subject keywords | n thin silicon die | |
| subject keywords | n throu | |
| identifier doi | 10.1109/ECTC.2014.6897355 | |
| journal title | omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE | |
| filesize | 95596 | |
| citations | 0 | |