Computation-aware motion estimation algorithm based on QoE control
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Year
: 2014DOI: 10.1109/ECTC.2014.6897355
Keyword(s): CMOS integrated circuits,n copper,n integrated circuit interconnections,n silicon,n three-dimensional integrated circuits,n wafer bonding,n 3Di wafer stacking,n CALM,n CMOS devices,n Cu,n Si,n TSV interconnections,n cavity alignment method,n chip bonding process technologies,n chip level bonding,n oxide bonding,n reflow furnace,n size 10 mum,n size 22 nm,n size 300 mm,n size 45 nm,n thermo-compression,n thin silicon die,n throu
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Computation-aware motion estimation algorithm based on QoE control
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| contributor author | Zhou Bing | |
| contributor author | Zhou Yanjie | |
| contributor author | Xu Mingliang | |
| contributor author | Wu Fei | |
| date accessioned | 2020-03-12T22:37:49Z | |
| date available | 2020-03-12T22:37:49Z | |
| date issued | 2014 | |
| identifier other | 7017207.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089300 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Computation-aware motion estimation algorithm based on QoE control | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227490 | |
| subject keywords | CMOS integrated circuits | |
| subject keywords | n copper | |
| subject keywords | n integrated circuit interconnections | |
| subject keywords | n silicon | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n wafer bonding | |
| subject keywords | n 3Di wafer stacking | |
| subject keywords | n CALM | |
| subject keywords | n CMOS devices | |
| subject keywords | n Cu | |
| subject keywords | n Si | |
| subject keywords | n TSV interconnections | |
| subject keywords | n cavity alignment method | |
| subject keywords | n chip bonding process technologies | |
| subject keywords | n chip level bonding | |
| subject keywords | n oxide bonding | |
| subject keywords | n reflow furnace | |
| subject keywords | n size 10 mum | |
| subject keywords | n size 22 nm | |
| subject keywords | n size 300 mm | |
| subject keywords | n size 45 nm | |
| subject keywords | n thermo-compression | |
| subject keywords | n thin silicon die | |
| subject keywords | n throu | |
| identifier doi | 10.1109/ECTC.2014.6897355 | |
| journal title | omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE | |
| filesize | 95596 | |
| citations | 0 |