The technical exploration of implementing hybrid TV with cloud computing in radio and TV industry
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Year
: 2014DOI: 10.1109/ECTC.2014.6897349
Keyword(s): copper,n grain boundary diffusion,n grain size,n reliability,n three-dimensional integrated circuits,n BEOL reliability,n Cu,n TSV,n back end of line processing,n grain size,n microstructure,n pumping,n through silicon vias,n twin boundaries,n Annealing,n Chemistry,n Correlation,n Grain boundaries,n Image color analysis,n Microstructure,n Through-silicon vias
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The technical exploration of implementing hybrid TV with cloud computing in radio and TV industry
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| contributor author | Xiang Zheng | |
| contributor author | Fang Xiong | |
| contributor author | YaoNan Dai | |
| date accessioned | 2020-03-12T22:37:48Z | |
| date available | 2020-03-12T22:37:48Z | |
| date issued | 2014 | |
| identifier other | 7017201.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089293?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | The technical exploration of implementing hybrid TV with cloud computing in radio and TV industry | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227482 | |
| subject keywords | copper | |
| subject keywords | n grain boundary diffusion | |
| subject keywords | n grain size | |
| subject keywords | n reliability | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n BEOL reliability | |
| subject keywords | n Cu | |
| subject keywords | n TSV | |
| subject keywords | n back end of line processing | |
| subject keywords | n grain size | |
| subject keywords | n microstructure | |
| subject keywords | n pumping | |
| subject keywords | n through silicon vias | |
| subject keywords | n twin boundaries | |
| subject keywords | n Annealing | |
| subject keywords | n Chemistry | |
| subject keywords | n Correlation | |
| subject keywords | n Grain boundaries | |
| subject keywords | n Image color analysis | |
| subject keywords | n Microstructure | |
| subject keywords | n Through-silicon vias | |
| identifier doi | 10.1109/ECTC.2014.6897349 | |
| journal title | omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE | |
| filesize | 160201 | |
| citations | 0 |