Liveness detection of dorsal hand vein based on AutoRegressive model
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Year
: 2014DOI: 10.1109/ECTC.2014.6897345
Keyword(s): assembling,n costing,n integrated circuit manufacture,n integrated circuit packaging,n integrated circuit reliability,n low-power electronics,n power consumption,n silicon,n three-dimensional integrated circuits,n 3D IC,n 3D assembly,n 3D packages,n 3D-2.5D technology,n IDM,n Moore',s law,n Si,n TSV integration,n cost effectiveness,n fabless company,n fabless foundry,n faster communication,n form factor,n heterogeneous integra
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Liveness detection of dorsal hand vein based on AutoRegressive model
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| contributor author | Yiding Wang | |
| contributor author | Qi Qi | |
| contributor author | Kefeng Li | |
| date accessioned | 2020-03-12T22:37:47Z | |
| date available | 2020-03-12T22:37:47Z | |
| date issued | 2014 | |
| identifier other | 7017197.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089289 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Liveness detection of dorsal hand vein based on AutoRegressive model | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227478 | |
| subject keywords | assembling | |
| subject keywords | n costing | |
| subject keywords | n integrated circuit manufacture | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n integrated circuit reliability | |
| subject keywords | n low-power electronics | |
| subject keywords | n power consumption | |
| subject keywords | n silicon | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 3D IC | |
| subject keywords | n 3D assembly | |
| subject keywords | n 3D packages | |
| subject keywords | n 3D-2.5D technology | |
| subject keywords | n IDM | |
| subject keywords | n Moore' | |
| subject keywords | s law | |
| subject keywords | n Si | |
| subject keywords | n TSV integration | |
| subject keywords | n cost effectiveness | |
| subject keywords | n fabless company | |
| subject keywords | n fabless foundry | |
| subject keywords | n faster communication | |
| subject keywords | n form factor | |
| subject keywords | n heterogeneous integra | |
| identifier doi | 10.1109/ECTC.2014.6897345 | |
| journal title | omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE | |
| filesize | 182510 | |
| citations | 0 |