Path prediction based on second-order Markov chain for the opportunistic networks
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سال
: 2014شناسه الکترونیک: 10.1109/ECTC.2014.6897329
کلیدواژه(گان): copper,n design of experiments,n finite element analysis,n integrated circuit packaging,n lead bonding,n palladium alloys,n silver,n ABAQUS-Explicit,n Ag,n Ag-Al,n Al pad deformation,n Al-Ag IMC,n Cu,n DOE assessment,n FAB formation,n FBGA package,n FEM simulation software,n FIB cut,n IC packaging,n PdCu,n axisymmetric transient nonlinear dynamic model,n ball bond side,n bond force application,n bond pad center area,n bond p
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Path prediction based on second-order Markov chain for the opportunistic networks
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| contributor author | Yubo Deng | |
| contributor author | Wei Liu | |
| contributor author | Lei Zhang | |
| contributor author | Yongping Xiong | |
| contributor author | Yunchuan Sun | |
| date accessioned | 2020-03-12T22:37:45Z | |
| date available | 2020-03-12T22:37:45Z | |
| date issued | 2014 | |
| identifier other | 7017181.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089269 | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Path prediction based on second-order Markov chain for the opportunistic networks | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227450 | |
| subject keywords | copper | |
| subject keywords | n design of experiments | |
| subject keywords | n finite element analysis | |
| subject keywords | n integrated circuit packaging | |
| subject keywords | n lead bonding | |
| subject keywords | n palladium alloys | |
| subject keywords | n silver | |
| subject keywords | n ABAQUS-Explicit | |
| subject keywords | n Ag | |
| subject keywords | n Ag-Al | |
| subject keywords | n Al pad deformation | |
| subject keywords | n Al-Ag IMC | |
| subject keywords | n Cu | |
| subject keywords | n DOE assessment | |
| subject keywords | n FAB formation | |
| subject keywords | n FBGA package | |
| subject keywords | n FEM simulation software | |
| subject keywords | n FIB cut | |
| subject keywords | n IC packaging | |
| subject keywords | n PdCu | |
| subject keywords | n axisymmetric transient nonlinear dynamic model | |
| subject keywords | n ball bond side | |
| subject keywords | n bond force application | |
| subject keywords | n bond pad center area | |
| subject keywords | n bond p | |
| identifier doi | 10.1109/ECTC.2014.6897329 | |
| journal title | omputing, Communications and IT Applications Conference (ComComAp), 2014 IEEE | |
| filesize | 153705 | |
| citations | 0 |