contributor author | Potter, J. | |
contributor author | Alves, J. | |
contributor author | Furfaro, T. | |
contributor author | Vermeij, A. | |
contributor author | Jourden, N. | |
contributor author | Zappa, G. | |
contributor author | Berni, A. | |
contributor author | Merani, D. | |
date accessioned | 2020-03-12T22:37:42Z | |
date available | 2020-03-12T22:37:42Z | |
date issued | 2014 | |
identifier other | 7017157.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089243?locale-attribute=en&show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Software Defined Open Architecture Modem development at CMRE | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8227422 | |
subject keywords | CMOS integrated circuits | |
subject keywords | n accelerometers | |
subject keywords | n aluminium | |
subject keywords | n chromium | |
subject keywords | n gold | |
subject keywords | n hermetic seals | |
subject keywords | n integrated circuit bonding | |
subject keywords | n integrated circuit packaging | |
subject keywords | n micromachining | |
subject keywords | n micromechanical devices | |
subject keywords | n silicon | |
subject keywords | n silicon-on-insulator | |
subject keywords | n three-dimensional integrated circuits | |
subject keywords | n 3D CMOS-on-MEMS stacking | |
subject keywords | n Al | |
subject keywords | n Au | |
subject keywords | n CMOS metal layer | |
subject keywords | n CMOS readout circuit | |
subject keywords | n Cr | |
subject keywords | n DRIE | |
subject keywords | n J-leaded ceramic package | |
subject keywords | n MEMS chip metallization | |
subject keywords | n MEMS metal layer | |
subject keywords | n M | |
identifier doi | 10.1109/ECTC.2014.6897306 | |
journal title | nderwater Communications and Networking (UComms), 2014 | |
filesize | 211022 | |
citations | 0 | |