An encryption and probability based access control model for named data networking
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Year
: 2014DOI: 10.1109/ECTC.2014.6897250
Keyword(s): electron device manufacture,n flexible electronics,n inductive power transmission,n integrated circuit modelling,n integrated optics,n optical interconnections,n professional aspects,n radiofrequency integrated circuits,n silicon,n three-dimensional integrated circuits,n wafer level packaging,n 3D technologies,n AD 2014,n ECTC,n IEEE conference,n RF packaging,n Si,n TSV technologies,n advanced packaging technologies,n electrical modeling
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An encryption and probability based access control model for named data networking
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| contributor author | Tao Chen | |
| contributor author | Kai Lei | |
| contributor author | Kuai Xu | |
| date accessioned | 2020-03-12T22:37:35Z | |
| date available | 2020-03-12T22:37:35Z | |
| date issued | 2014 | |
| identifier other | 7017100.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1089182?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | An encryption and probability based access control model for named data networking | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8227348 | |
| subject keywords | electron device manufacture | |
| subject keywords | n flexible electronics | |
| subject keywords | n inductive power transmission | |
| subject keywords | n integrated circuit modelling | |
| subject keywords | n integrated optics | |
| subject keywords | n optical interconnections | |
| subject keywords | n professional aspects | |
| subject keywords | n radiofrequency integrated circuits | |
| subject keywords | n silicon | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n wafer level packaging | |
| subject keywords | n 3D technologies | |
| subject keywords | n AD 2014 | |
| subject keywords | n ECTC | |
| subject keywords | n IEEE conference | |
| subject keywords | n RF packaging | |
| subject keywords | n Si | |
| subject keywords | n TSV technologies | |
| subject keywords | n advanced packaging technologies | |
| subject keywords | n electrical modeling | |
| identifier doi | 10.1109/ECTC.2014.6897250 | |
| journal title | erformance Computing and Communications Conference (IPCCC), 2014 IEEE International | |
| filesize | 359669 | |
| citations | 0 |