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Separation of failure modes in short cycle time power cycling experiments

Author:
Sarkany, Zoltan
,
Vass-Varnai, Andras
,
Rencz, Marta
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ISPASS.2014.6844476
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1069222
Keyword(s): integrated circuit packaging,n integrated circuit reliability,n low-power electronics,n microprocessor chips,n multiprocessing systems,n thermal management (packaging),n energy introspector,n integrated power-reliability-thermal modeling,n multicore architectures,n power management technique,n thermal management technique,n Computational modeling,n Computer architecture,n Data models,n Integrated circuit modeling,n Libraries,n Microarchitecture
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    Separation of failure modes in short cycle time power cycling experiments

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contributor authorSarkany, Zoltan
contributor authorVass-Varnai, Andras
contributor authorRencz, Marta
date accessioned2020-03-12T22:02:17Z
date available2020-03-12T22:02:17Z
date issued2014
identifier other6972528.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1069222?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleSeparation of failure modes in short cycle time power cycling experiments
typeConference Paper
contenttypeMetadata Only
identifier padid8204493
subject keywordsintegrated circuit packaging
subject keywordsn integrated circuit reliability
subject keywordsn low-power electronics
subject keywordsn microprocessor chips
subject keywordsn multiprocessing systems
subject keywordsn thermal management (packaging)
subject keywordsn energy introspector
subject keywordsn integrated power-reliability-thermal modeling
subject keywordsn multicore architectures
subject keywordsn power management technique
subject keywordsn thermal management technique
subject keywordsn Computational modeling
subject keywordsn Computer architecture
subject keywordsn Data models
subject keywordsn Integrated circuit modeling
subject keywordsn Libraries
subject keywordsn Microarchitecture
identifier doi10.1109/ISPASS.2014.6844476
journal titlehermal Investigations of ICs and Systems (THERMINIC), 2014 20th International Workshop on
filesize641808
citations0
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