| contributor author | Nhat Ly |  | 
| contributor author | Mayer, Michael |  | 
| contributor author | Ramadhan, Ali |  | 
| contributor author | Sanderson, Joseph |  | 
| date accessioned | 2020-03-12T21:57:46Z |  | 
| date available | 2020-03-12T21:57:46Z |  | 
| date issued | 2014 |  | 
| identifier other | 6968136.pdf |  | 
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1066603?locale-attribute=en&show=full |  | 
| format | general |  | 
| language | English |  | 
| publisher | IEEE |  | 
| title | Welding of Au microwires by femtosecond laser irradiation |  | 
| type | Conference Paper |  | 
| contenttype | Metadata Only |  | 
| identifier padid | 8200719 |  | 
| subject keywords | CMOS integrated circuits |  | 
| subject keywords | n			integrated circuit layout |  | 
| subject keywords | n			low-power electronics |  | 
| subject keywords | n			three-dimensional integrated circuits |  | 
| subject keywords | n			3D-ICs |  | 
| subject keywords | n			CMOS-technology |  | 
| subject keywords | n			RC-extracted layouts |  | 
| subject keywords | n			TSV technology |  | 
| subject keywords | n			area consumption |  | 
| subject keywords | n			area efficient analysis |  | 
| subject keywords | n			bit rate 8 Gbit/s |  | 
| subject keywords | n			circuit simulations |  | 
| subject keywords | n			circuit-level design |  | 
| subject keywords | n			design space exploration |  | 
| subject keywords | n			energy efficiency |  | 
| subject keywords | n			high bandwidth inter-chip connections |  | 
| subject keywords | n			high-data-rate 3D serial TSV links |  | 
| subject keywords | n			low-power chip-to-chip commun |  | 
| identifier doi | 10.1109/ICICDT.2014.6838583 |  | 
| journal title | anotechnology (IEEE-NANO), 2014 IEEE 14th International Conference on |  | 
| filesize | 694781 |  | 
| citations | 0 |  |