Welding of Au microwires by femtosecond laser irradiation
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: 2014DOI: 10.1109/ICICDT.2014.6838583
Keyword(s): CMOS integrated circuits,n integrated circuit layout,n low-power electronics,n three-dimensional integrated circuits,n 3D-ICs,n CMOS-technology,n RC-extracted layouts,n TSV technology,n area consumption,n area efficient analysis,n bit rate 8 Gbit/s,n circuit simulations,n circuit-level design,n design space exploration,n energy efficiency,n high bandwidth inter-chip connections,n high-data-rate 3D serial TSV links,n low-power chip-to-chip commun
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Welding of Au microwires by femtosecond laser irradiation
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| contributor author | Nhat Ly | |
| contributor author | Mayer, Michael | |
| contributor author | Ramadhan, Ali | |
| contributor author | Sanderson, Joseph | |
| date accessioned | 2020-03-12T21:57:46Z | |
| date available | 2020-03-12T21:57:46Z | |
| date issued | 2014 | |
| identifier other | 6968136.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1066603?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Welding of Au microwires by femtosecond laser irradiation | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8200719 | |
| subject keywords | CMOS integrated circuits | |
| subject keywords | n integrated circuit layout | |
| subject keywords | n low-power electronics | |
| subject keywords | n three-dimensional integrated circuits | |
| subject keywords | n 3D-ICs | |
| subject keywords | n CMOS-technology | |
| subject keywords | n RC-extracted layouts | |
| subject keywords | n TSV technology | |
| subject keywords | n area consumption | |
| subject keywords | n area efficient analysis | |
| subject keywords | n bit rate 8 Gbit/s | |
| subject keywords | n circuit simulations | |
| subject keywords | n circuit-level design | |
| subject keywords | n design space exploration | |
| subject keywords | n energy efficiency | |
| subject keywords | n high bandwidth inter-chip connections | |
| subject keywords | n high-data-rate 3D serial TSV links | |
| subject keywords | n low-power chip-to-chip commun | |
| identifier doi | 10.1109/ICICDT.2014.6838583 | |
| journal title | anotechnology (IEEE-NANO), 2014 IEEE 14th International Conference on | |
| filesize | 694781 | |
| citations | 0 |