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AR-concepts for hermetic wafer level packaging of uncooled FIR bolometer arrays

contributor authorStenchly, Vanessa
contributor authorLofink, Fabian
contributor authorReinert, Wolfgang
date accessioned2020-03-12T21:52:43Z
date available2020-03-12T21:52:43Z
date issued2014
identifier other6962844.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063700?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleAR-concepts for hermetic wafer level packaging of uncooled FIR bolometer arrays
typeConference Paper
contenttypeMetadata Only
identifier padid8196102
subject keywordsZigbee
subject keywordsn multilayer perceptrons
subject keywordsn telecommunication computing
subject keywordsn wireless sensor networks
subject keywordsn IEEE 802.15.4
subject keywordsn MLP
subject keywordsn WSN localization data
subject keywordsn multilayered perceptron
subject keywordsn range based localization data
subject keywordsn training functions
subject keywordsn wireless sensor network localization data
subject keywordsn Analytical models
subject keywordsn Backpropagation
subject keywordsn Data models
subject keywordsn Mathematical model
subject keywordsn Neurons
subject keywordsn Training
subject keywordsn Wireless sensor networks
subject keywordsn Localization
subject keywordsn MLP
subject keywordsn Neural Networks
subject keywordsn Training algorith
identifier doi10.1109/IndiaCom.2014.6828137
journal titlelectronics System-Integration Technology Conference (ESTC), 2014
filesize899780
citations0


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