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date accessioned2020-03-12T21:51:36Z
date available2020-03-12T21:51:36Z
date issued2014
identifier other6961800.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1063057?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleTable of contents
typeConference Paper
contenttypeMetadata Only
identifier padid8195141
subject keywordsfinite element analysis
subject keywordsn reflow soldering
subject keywordsn semiconductor device packaging
subject keywordsn system-in-package
subject keywordsn thermal stress cracking
subject keywordsn thermal stresses
subject keywordsn three-dimensional integrated circuits
subject keywordsn voids (solid)
subject keywordsn yield stress
subject keywordsn 3D SiP
subject keywordsn Cu
subject keywordsn FEM
subject keywordsn Si
subject keywordsn TSV low cycle fatigue
subject keywordsn TSV structure
subject keywordsn bending strength
subject keywordsn bending stress
subject keywordsn device operation conditions
subject keywordsn finite element method
subject keywordsn materials interface
subject keywordsn maximum principal stress
subject keywordsn reflow process
identifier doi10.1109/ICEP.2014.6826670
journal titleischarges and Electrical Insulation in Vacuum (ISDEIV), 2014 International Symposium on
filesize278585
citations0


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