Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators
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Year
: 2014DOI: 10.1109/EDAPS.2014.7030816
Keyword(s): Codecs,Routing,Silicon,Substrates,System-on-chip,Vehicles,2.5D-IC,2D-IC,Advanced eXtensible Interface (AXI),Die-to-Die,Interposer,MCM,SiP,SoC,TSV,flip-chip,micro bumps,wire-bonds
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Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators
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contributor author | Kuraishi, K. | |
contributor author | Nanahara, T. | |
date accessioned | 2020-03-12T21:19:56Z | |
date available | 2020-03-12T21:19:56Z | |
date issued | 2014 | |
identifier other | 6934656.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1045150?locale-attribute=en | |
format | general | |
language | English | |
publisher | IEEE | |
title | Fundamental study on voltage stability of induction generators for wind power generation — Voltage-power curves for various types of generators | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8173649 | |
subject keywords | Codecs | |
subject keywords | Routing | |
subject keywords | Silicon | |
subject keywords | Substrates | |
subject keywords | System-on-chip | |
subject keywords | Vehicles | |
subject keywords | 2.5D-IC | |
subject keywords | 2D-IC | |
subject keywords | Advanced eXtensible Interface (AXI) | |
subject keywords | Die-to-Die | |
subject keywords | Interposer | |
subject keywords | MCM | |
subject keywords | SiP | |
subject keywords | SoC | |
subject keywords | TSV | |
subject keywords | flip-chip | |
subject keywords | micro bumps | |
subject keywords | wire-bonds | |
identifier doi | 10.1109/EDAPS.2014.7030816 | |
journal title | ower Engineering Conference (UPEC), 2014 49th International Universities | |
filesize | 348052 | |
citations | 0 |