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Manufacturing and reliability of chip-scale packaged FBAR oscillators

contributor authorGilbert, S.R.
contributor authorSmall, M.
contributor authorParker, R.
contributor authorCallaghan, L.
contributor authorOrtiz, S.
contributor authorBi, F.
contributor authorKekoa, L.
contributor authorTan, J.
contributor authorBin Alias, N.
contributor authorOng, G.
contributor authorChen, C.C.
contributor authorRuby, R.
date accessioned2020-03-12T21:16:43Z
date available2020-03-12T21:16:43Z
date issued2014
identifier other6932334.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1043236?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleManufacturing and reliability of chip-scale packaged FBAR oscillators
typeConference Paper
contenttypeMetadata Only
identifier padid8171206
subject keywordsairborne radar
subject keywordsdigital elevation models
subject keywordserror compensation
subject keywordsmotion compensation
subject keywordsradar interferometry
subject keywordssynthetic aperture radar
subject keywordsweather forecasting
subject keywordsDEM generation
subject keywordsMOCO procedure
subject keywordsSynthetic Aperture Radar Interferometry
subject keywordsX-band operation
subject keywordsairborne SAR interferometry
subject keywordsairborne case
subject keywordsalgorithm effectiveness
subject keywordschain processing
subject keywordsdigital elevation model generation
subject keywordsexternal low accuracy DEM
subject keywordsfinal InSAR DEM
subject keywordsfocusing step
subject keywordsilluminated area
subject keywordsjoint InSAR phase offset calculation novel algorithm
subject keywordsmot
identifier doi10.1109/IGARSS.2014.6946342
journal titleltrasonics Symposium (IUS), 2014 IEEE International
filesize1377232
citations0


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