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3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity

contributor authorWang, L.
contributor authorBrown, A.R.
contributor authorNedjalkov, M.
contributor authorAlexander, C.
contributor authorCheng, B.
contributor authorMillar, C.
contributor authorAsenov, A.
date accessioned2020-03-12T21:15:34Z
date available2020-03-12T21:15:34Z
date issued2014
identifier other6931615.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1042573?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
title3D coupled electro-thermal FinFET simulations including the fin shape dependence of the thermal conductivity
typeConference Paper
contenttypeMetadata Only
identifier padid8170303
subject keywordsBuildings
subject keywordsHeating
subject keywordsMatrix decomposition
subject keywordsPrincipal component analysis
subject keywordsTemperature sensors
subject keywordsValves
identifier doi10.1109/MED.2014.6961484
journal titleimulation of Semiconductor Processes and Devices (SISPAD), 2014 International Conference on
filesize1114515
citations0


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