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Smart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services

contributor authorChichin, S.
contributor authorChhetri, M.B.
contributor authorQuoc Bao Vo
contributor authorKowalczyk, R.
contributor authorStepniak, M.
date accessioned2020-03-12T21:10:48Z
date available2020-03-12T21:10:48Z
date issued2014
identifier other6928211.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1039776?locale-attribute=fa&show=full
formatgeneral
languageEnglish
publisherIEEE
titleSmart Cloud Marketplace - Agent-Based Platform for Trading Cloud Services
typeConference Paper
contenttypeMetadata Only
identifier padid8166665
subject keywordschip-on-board packaging
subject keywordscooling
subject keywordselectronic engineering computing
subject keywordsfinite element analysis
subject keywordsglass
subject keywordslight emitting diodes
subject keywordsthermal analysis
subject keywordsthermal management (packaging)
subject keywordsANSYS software
subject keywordsCOB heat dissipation performance
subject keywordsLED chip packaging
subject keywordschip gaps
subject keywordschip sizes
subject keywordschip-on-board
subject keywordsglass substrate
subject keywordsheat dissipation performance
subject keywordsinsulation
subject keywordslight transmission
subject keywordsoptimized packaging structure
subject keywordspackaging material
subject keywordssubstrate material
subject keywordssubstrate thickness
subject keywordsthermal analysis
subject keywordsthermal management scheme
subject keywordsGla
identifier doi10.1109/ICEPT.2014.6922764
journal titleeb Intelligence (WI) and Intelligent Agent Technologies (IAT), 2014 IEEE/WIC/ACM International Joint
filesize820889
citations0


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