•  English
    • Persian
    • English
  •   Login
  • Ferdowsi University of Mashhad
  • |
  • Information Center and Central Library
    • Persian
    • English
  • Home
  • Source Types
    • Journal Paper
    • Ebook
    • Conference Paper
    • Standard
    • Protocol
    • Thesis
  • Use Help
View Item 
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  • All Fields
  • Title
  • Author
  • Year
  • Publisher
  • Subject
  • Publication Title
  • ISSN
  • DOI
  • ISBN
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Optimistic design of freestanding horseshoe metal interconnects for stretchable electronic circuits

Author:
Na Wei
,
Kailin Pan
,
Hua Lin
,
Renzhang Chen
,
Benshuai Guo
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/ICELMACH.2014.6960160
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1035637
Keyword(s): Analytical models,Conductors,Impedance,Inductance,Integrated circuit modeling,Mathematical model,Resistance,AC machines,Analytical models,eddy current,equivalent circuits,finite element analysis,induction motors,mathematical model,mutual coupling
Collections :
  • Latin Articles
  • Show Full MetaData Hide Full MetaData
  • Statistics

    Optimistic design of freestanding horseshoe metal interconnects for stretchable electronic circuits

Show full item record

contributor authorNa Wei
contributor authorKailin Pan
contributor authorHua Lin
contributor authorRenzhang Chen
contributor authorBenshuai Guo
date accessioned2020-03-12T21:03:46Z
date available2020-03-12T21:03:46Z
date issued2014
identifier other6922944.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1035637?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleOptimistic design of freestanding horseshoe metal interconnects for stretchable electronic circuits
typeConference Paper
contenttypeMetadata Only
identifier padid8161720
subject keywordsAnalytical models
subject keywordsConductors
subject keywordsImpedance
subject keywordsInductance
subject keywordsIntegrated circuit modeling
subject keywordsMathematical model
subject keywordsResistance
subject keywordsAC machines
subject keywordsAnalytical models
subject keywordseddy current
subject keywordsequivalent circuits
subject keywordsfinite element analysis
subject keywordsinduction motors
subject keywordsmathematical model
subject keywordsmutual coupling
identifier doi10.1109/ICELMACH.2014.6960160
journal titlelectronic Packaging Technology (ICEPT), 2014 15th International Conference on
filesize500705
citations0
  • About Us
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
DSpace software copyright © 2019-2022  DuraSpace