•  English
    • Persian
    • English
  •   Login
  • Ferdowsi University of Mashhad
  • |
  • Information Center and Central Library
    • Persian
    • English
  • Home
  • Source Types
    • Journal Paper
    • Ebook
    • Conference Paper
    • Standard
    • Protocol
    • Thesis
  • Use Help
View Item 
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  •   FUM Digital Library
  • Fum
  • Articles
  • Latin Articles
  • View Item
  • All Fields
  • Title
  • Author
  • Year
  • Publisher
  • Subject
  • Publication Title
  • ISSN
  • DOI
  • ISBN
Advanced Search
JavaScript is disabled for your browser. Some features of this site may not work without it.

Intel enterprise server processor packaging challenge and future trend

Author:
Zhao, R.
Publisher:
IEEE
Year
: 2014
DOI: 10.1109/IWAT.2014.6958597
URI: https://libsearch.um.ac.ir:443/fum/handle/fum/1035635
Keyword(s): Antenna measurements,Microstrip,Microstrip antennas,Switches,Wireless LAN,Reconfigurable antennas,aperture-coupled,dual-band antennas,microstrip antennas,polarization diversity
Collections :
  • Latin Articles
  • Show Full MetaData Hide Full MetaData
  • Statistics

    Intel enterprise server processor packaging challenge and future trend

Show full item record

contributor authorZhao, R.
date accessioned2020-03-12T21:03:46Z
date available2020-03-12T21:03:46Z
date issued2014
identifier other6922942.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1035635?locale-attribute=en
formatgeneral
languageEnglish
publisherIEEE
titleIntel enterprise server processor packaging challenge and future trend
typeConference Paper
contenttypeMetadata Only
identifier padid8161718
subject keywordsAntenna measurements
subject keywordsMicrostrip
subject keywordsMicrostrip antennas
subject keywordsSwitches
subject keywordsWireless LAN
subject keywordsReconfigurable antennas
subject keywordsaperture-coupled
subject keywordsdual-band antennas
subject keywordsmicrostrip antennas
subject keywordspolarization diversity
identifier doi10.1109/IWAT.2014.6958597
journal titlelectronic Packaging Technology (ICEPT), 2014 15th International Conference on
filesize4003876
citations0
  • About Us
نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
DSpace software copyright © 2019-2022  DuraSpace