contributor author | Yuwei Zheng | |
contributor author | Shengxiang Bao | |
contributor author | Zhenzhen Rao | |
contributor author | Chengshi Zhang | |
contributor author | Yao Yan | |
date accessioned | 2020-03-12T21:03:33Z | |
date available | 2020-03-12T21:03:33Z | |
date issued | 2014 | |
identifier other | 6922814.pdf | |
identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1035507?locale-attribute=en&show=full | |
format | general | |
language | English | |
publisher | IEEE | |
title | Analysis of laser typing spots at gold-plated kovar alloy cavity | |
type | Conference Paper | |
contenttype | Metadata Only | |
identifier padid | 8161573 | |
subject keywords | bubbles | |
subject keywords | ceramics | |
subject keywords | coatings | |
subject keywords | electronics packaging | |
subject keywords | gels | |
subject keywords | hydrostatics | |
subject keywords | lead bonding | |
subject keywords | microsensors | |
subject keywords | pressure sensors | |
subject keywords | MEMS pressure sensor | |
subject keywords | bubble inflation | |
subject keywords | bubbles effect | |
subject keywords | ceramic substrate | |
subject keywords | chip surface protection | |
subject keywords | coating gel | |
subject keywords | cured gel | |
subject keywords | curing processes | |
subject keywords | dispensing gel process | |
subject keywords | dispensing process parameters | |
subject keywords | elevated air pressure | |
subject keywords | hydrostatic fluid-element based 2D models | |
subject keywords | low-pressure sensor module production | |
subject keywords | mechanical behavior | |
subject keywords | packaged modules | |
subject keywords | sensing membrane | |
subject keywords | sensor chip | |
subject keywords | silicon ch | |
identifier doi | 10.1109/ICEPT.2014.6922738 | |
journal title | lectronic Packaging Technology (ICEPT), 2014 15th International Conference on | |
filesize | 521294 | |
citations | 0 | |