A new interconnection/transition method using bumping-bridge structure for 1-level package of RF MEMS devices
ناشر:
سال
: 2014شناسه الکترونیک: 10.1109/IIH-MSP.2014.166
کلیدواژه(گان): Authentication,Indexes,Protocols,Radiofrequency identification,Servers,DoS attack,EPC Class 1 Generation 2,RFID,mutual authentication,privacy,replay attack
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آمار بازدید
A new interconnection/transition method using bumping-bridge structure for 1-level package of RF MEMS devices
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| contributor author | Lei Chen | |
| contributor author | Wei Xu | |
| contributor author | Deyang Yan | |
| contributor author | Cheng Zhao | |
| contributor author | Yi Wang | |
| contributor author | Yue Sun | |
| date accessioned | 2020-03-12T21:03:24Z | |
| date available | 2020-03-12T21:03:24Z | |
| date issued | 2014 | |
| identifier other | 6922727.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1035420?locale-attribute=fa | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | A new interconnection/transition method using bumping-bridge structure for 1-level package of RF MEMS devices | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8161472 | |
| subject keywords | Authentication | |
| subject keywords | Indexes | |
| subject keywords | Protocols | |
| subject keywords | Radiofrequency identification | |
| subject keywords | Servers | |
| subject keywords | DoS attack | |
| subject keywords | EPC Class 1 Generation 2 | |
| subject keywords | RFID | |
| subject keywords | mutual authentication | |
| subject keywords | privacy | |
| subject keywords | replay attack | |
| identifier doi | 10.1109/IIH-MSP.2014.166 | |
| journal title | lectronic Packaging Technology (ICEPT), 2014 15th International Conference on | |
| filesize | 376582 | |
| citations | 0 |