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A new interconnection/transition method using bumping-bridge structure for 1-level package of RF MEMS devices

contributor authorLei Chen
contributor authorWei Xu
contributor authorDeyang Yan
contributor authorCheng Zhao
contributor authorYi Wang
contributor authorYue Sun
date accessioned2020-03-12T21:03:24Z
date available2020-03-12T21:03:24Z
date issued2014
identifier other6922727.pdf
identifier urihttps://libsearch.um.ac.ir:443/fum/handle/fum/1035420?locale-attribute=en&show=full
formatgeneral
languageEnglish
publisherIEEE
titleA new interconnection/transition method using bumping-bridge structure for 1-level package of RF MEMS devices
typeConference Paper
contenttypeMetadata Only
identifier padid8161472
subject keywordsAuthentication
subject keywordsIndexes
subject keywordsProtocols
subject keywordsRadiofrequency identification
subject keywordsServers
subject keywordsDoS attack
subject keywordsEPC Class 1 Generation 2
subject keywordsRFID
subject keywordsmutual authentication
subject keywordsprivacy
subject keywordsreplay attack
identifier doi10.1109/IIH-MSP.2014.166
journal titlelectronic Packaging Technology (ICEPT), 2014 15th International Conference on
filesize376582
citations0


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