Annealing temperature dependence of SAB based Si/Si junctions
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Year
: 2014DOI: 10.1109/ISSREW.2014.12
Keyword(s): Data models,Software reliability,Time measurement,Web servers,Defect Analysis,Reliability Modeling,Software Reliability Analysis,Workload Measurement
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Annealing temperature dependence of SAB based Si/Si junctions
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| date accessioned | 2020-03-12T20:43:44Z | |
| date available | 2020-03-12T20:43:44Z | |
| date issued | 2014 | |
| identifier other | 6886191.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1023345?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Annealing temperature dependence of SAB based Si/Si junctions | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8148167 | |
| subject keywords | Data models | |
| subject keywords | Software reliability | |
| subject keywords | Time measurement | |
| subject keywords | Web servers | |
| subject keywords | Defect Analysis | |
| subject keywords | Reliability Modeling | |
| subject keywords | Software Reliability Analysis | |
| subject keywords | Workload Measurement | |
| identifier doi | 10.1109/ISSREW.2014.12 | |
| journal title | ow Temperature Bonding for 3D Integration (LTB-3D), 2014 4th IEEE International Workshop on | |
| filesize | 696808 | |
| citations | 0 | |
| contributor rawauthor | Morimoto, M. , Liang, J. , Nishida, S. , Chai Li , Takemura, K. , Shigekawa, N. |