Indoor positioning of wheeled devices for Ambient Assisted Living: A case study
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Year
: 2014DOI: 10.1109/ICEPT.2014.6922880
Keyword(s): brazing,electronics packaging,failure analysis,heat conduction,heat sinks,shear strength,thermal expansion,ultrasonic applications,DBC,IMC,alumina ceramic substrate,alumina-copper joints,brazing temperature,brazing time,coefficient-of-thermal expansion,constant brazing time,copper heat sink,copper substrate,direct bonded copper,failure region,heat conduction,heat transfer substrates,high-performance joints,high-power electronics,intermetallic compounds,joint quality,low
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Indoor positioning of wheeled devices for Ambient Assisted Living: A case study
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| date accessioned | 2020-03-12T20:16:46Z | |
| date available | 2020-03-12T20:16:46Z | |
| date issued | 2014 | |
| identifier other | 6860980.pdf | |
| identifier uri | https://libsearch.um.ac.ir:443/fum/handle/fum/1008616?locale-attribute=en | |
| format | general | |
| language | English | |
| publisher | IEEE | |
| title | Indoor positioning of wheeled devices for Ambient Assisted Living: A case study | |
| type | Conference Paper | |
| contenttype | Metadata Only | |
| identifier padid | 8130519 | |
| subject keywords | brazing | |
| subject keywords | electronics packaging | |
| subject keywords | failure analysis | |
| subject keywords | heat conduction | |
| subject keywords | heat sinks | |
| subject keywords | shear strength | |
| subject keywords | thermal expansion | |
| subject keywords | ultrasonic applications | |
| subject keywords | DBC | |
| subject keywords | IMC | |
| subject keywords | alumina ceramic substrate | |
| subject keywords | alumina-copper joints | |
| subject keywords | brazing temperature | |
| subject keywords | brazing time | |
| subject keywords | coefficient-of-thermal expansion | |
| subject keywords | constant brazing time | |
| subject keywords | copper heat sink | |
| subject keywords | copper substrate | |
| subject keywords | direct bonded copper | |
| subject keywords | failure region | |
| subject keywords | heat conduction | |
| subject keywords | heat transfer substrates | |
| subject keywords | high-performance joints | |
| subject keywords | high-power electronics | |
| subject keywords | intermetallic compounds | |
| subject keywords | joint quality | |
| subject keywords | low | |
| identifier doi | 10.1109/ICEPT.2014.6922880 | |
| journal title | nstrumentation and Measurement Technology Conference (I2MTC) Proceedings, 2014 IEEE International | |
| filesize | 349946 | |
| citations | 0 | |
| contributor rawauthor | Nazemzadeh, P. , Fontanelli, D. , Macii, D. , Palopoli, L. |